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Semiconductor
Yellow Light Room Process Equipment
Other Semiconductor Process Related
Auto parts manufacturing equipment
Product Design
Outdoor GreenTech
RF Wireless COMM.& GPS device
Solar Backpacks
Portable Solar Panels
About Us
About Us
Electronic catalog
CN website
Knowledge Base
Knowledge Base
Upcoming Events
News
Contact Us
Collaborate with Us
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Cutting suction cups
Cutting suction cups
Regular price
$0.00
/
機型
HP03
HP03 -
$0.00 TWD
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Wafer dicing chuck, surface flatness within 3㎛
HP03
■ External Dimensions Weight:
L: 296mm x W: 296mm x H: 12mm
■ heavy
quantity:
Weight about 4kg
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