Plasma Etcher

Plasma Etcher

Regular price
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High-density plasma, fast etching speed, uniform flow design to ensure etching uniformity <±3%

CC3

 The wafer temperature is controllable , and the process flexibility is strong. Each batch of 8 4-inch wafers has high production efficiency.

 Automatic control, stable and reliable, good repeatability.

■ External Dimensions Weight:

  • L: 4000 x D: 1650 x H: 2030mm

■ heavy   quantity:

  • Weight about 250kg